The LH6 Kit for DB4 was designed to expand the CPU cooling from a single side panel to two side panels. It comprises of heat pipes, heak sink connectors, universal brackets and thermal pads/paste. When assembled correctly and with the appropriate environmental conditions, the total cooling performance can reach 105W* of heat dissipation. Whilst the stock DB4 heat pipes have been designed to work with virtually any motherboard layout, the LH6 will require a compatible CPU location and motherboard, see our system build guide for more details.
In addition to the main 65W, total 100W
6mm Diameter, 30-35W Rating
Coverage from the Heat Sink to CPU Location
56mm Wide, 6 Channels
Used to Secure the Heat Sink Mount