How do I know if a motherboard is compatible with the heat pipes?

There are really only 3 key points to check in order to determine if a motherboard is going to be compatible with the heat pipes (passive case cooling) ..... CPU socket location - this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this. CPU socket type - this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount. Component placement - probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink). Additional heat pipes are available for some cases to allow for different locations and the HT4 can be used to raise the heat pipes above some components LH4 - Compatible with the FC5, FC9, FC10 SH8, MH1 - Compatible with the FC8 HT4 - Compatible with the FC8*, FC9, FC10 If you are unsure, just get in touch, send us a link to the motherboard you are considering and we will confirm its compatible.

What CPU sockets are compatible with the case?

The current CPU mount supplied with the case features adjustable arms that are compatible with the majority of current desktop sockets Intel® Socket LGA775 LGA1366 LGA1155/6 LGA1150/1 LGA1200 LGA 2011-3* LGA1700 AMD® Socket AM2 & 2+ AM3 & 3+ FM1 FM2 AM1 AM4 Older units (pre-2019) Intel® Socket LGA775 LGA1366 LGA1155/6 LGA1150/1 AMD® Socket AM1*1 AMD® Socket AM2 & 2+ AM3 & 3+ FM1 FM2 AM4*2

FC10 – Fanless ATX Case

FC10

AV Style Fanless HTPC Case

The FC10 follows the same vision as the FC9, a stunning design that delivers new levels of compatibility and performance, but with a 435mm wide form factor that perfectly complements any home theatre setup. The all-aluminium sandblasted finish houses a multitude of features such as heat pipe Direct Touch cooling, universal optical drive eject button and a pivoting drive cage that makes assembly easier than ever. More than just a computer enclosure, the FC10 is a work of art that beautifully combines form and function.

It’s not easy to improve on the stunning design of the original FC10, so we didn’t, instead we focused on the performance and tweaked the finish of its beautiful exterior.

Internal airflow has been optimized with a revised bottom panel layout and drive tray, both of which also allow for more drives and the use of our new optical drive tray.
The expansion slots have been adjusted to accommodate dual slot cards and USB ports are now located on both side panels for easier access and balance.

As with all Alpha cases, we have improved manufacturing tolerances, introduced a new refined sandblast finish, USB3.0 is native, the power LED is now a subtle pure white, the heat pipes and mounts have been uprated, and it’s available with and without an optical drive opening.

What is true of the original FC10 can be said for the FC10 Alpha, its a work of art that beautifully combines form and function.

The original FC10 was launched in 2012 and was replaced by the V2 AKA the Alpha version

Overview

Specs

Dimensions

Gallery

Form Factor

ATX

AV component width, desktop with ATX, M-ATX and ITX motherboard support

PSU

ZF240

ZF240 or Nano type PSU (external AC + DC PCB)

CPU Cooling

87W

*MAX TDP,
65W Recommended TDP

Expansion

190mm

Dual slot, Upper 190mm, lower 300mm. Flexible riser required

Drives

3.5" & 2.5"

2 x 3.5″ + 3 x 2.5″ on bracket,
5 x 3.5″ + 4 x 2.5″ on bottom (hardware dependent)

Optical

12.7mm

OPT version support 12.7mm slot loading drive

I/O Support

2 x USB A

1 x Type-A 3.0 with 19PIN motherboard connector on each side panel (heat sink)

IR Support

Optional

Front Panel IR Window,
Support for Flirc Module

Dimensions

13.9ℓ

435 x 319 x 100mm (W x D x H, 109mm including feet),
Internal - 380 x 310 x 93mm

Weight

5.4kg

5.4kg NET
7.2kg GROSS
(packed weight)

Material

AL6063

All main parts are Aluminium 6063, Extruded, CNC'd

Finish

Sandblast

Sandblast and anodized surface treatment, available in black, silver & titanium

Model

Black

SKU: ST-F10B-ALPHA-OPT
EAN: 8718469091065

SKU: ST-F10B-ALPHA
EAN: 8718469091041

Model

Silver

SKU: ST-F10S-ALPHA-OPT
EAN: 8718469091072

SKU: ST-F10S-ALPHA
EAN: 8718469091058

Features

EXTRUDED AND PRECISION MILLED PANELS

Unlike the majority of cases on the market (even the aluminium ones) the panels of the FC10 are constructed using a meticulous process of extruding aluminium profiles that are then precision milling, hand polishing, sandblasting and finished using anodizing. This give an ultra premium look, feel and finish to all the parts.

PERFECTLY SUITED FOR THE LIVING ROOM ENVIRONMENT

Designed with AV equipment in mind, with fanless (no noise) cooling subtle styling and illumination, optional optical drive and IR support, all wrapped in a beautiful premium aluminium sandblasted finish, the FC10 is the ideal platform for a high end HTPC system

X, Y & Z HEAT PIPE ADJUSTMENT

Whist our previous cases all feature an adjustable heat pipe mounting solution to accommodate for different motherboard CPU locations, the FC10 is also capable of overcoming tall components such as VRM cooling heat sinks when combined with the optional HT4. This option to raise the heat pipes above obstacles on the motherboard gives the FC10 a unique height adjustment allowing for greater motherboard compatibility.

WIDE RANGE OF HARDWARE SUPPORT

The FC10 has support for mini-ITX, Micro ATX and Full ATX motherboard and can accept the compact NanoPSU or ZF240 PSU solution. It also has a dedicated drive tray that can accommodate 3.5″ and 2.5″ drive, plus an optical version for slot-loading drives.

Reviews & Media Coverage

View All

Hardware Journal

Written Review

Insgesamt macht das Streacom FC10 Alpha einen guten Eindruck und kann durch eine hohe Verarbeitung, gute Temperature-Werte und die lautlose.....

Singularity Computers

Video Review

A look at the ultimate HTPC case from Streacom, the FC10 Alpha. This is a 4mm thick full 6063 Alloy.....

Nikk Tech

Written Review

Streacom may not be one of the largest or most popular manufacturers of PC cases in the market today but.....

Technic 3D

Written Review

Mit Sicherheit handelt es sich bei dem FC10S um einen Exoten. Das „Fanless-Konzept“ passt sehr gut zum HTPC-Bereich und ermöglicht.....

Actualidad Hardware

Written Review

Tras probar la STREACOM FC10 hemos quedado realmente satisfechos tanto por su diseño, calidad de construcción así como por su.....

Benchmark

Written Review

Ode mnie Streacom FC10 otrzymuje zasłużoną ocenę: „Super produkt 5/5”. Taka ocena jest podyktowana wysoką jakością wykonania, odpowiednią wydajnością chłodzenia.....

AnandTech

Written Review

Describing the chassis itself as a thing of beauty would be an understatement. Our sample unit came in black (silver.....

Support

FAQs

Downloads

As part of the cooler assembly, the heat pipes will pass over the motherboard to reach the side panel (heat sink). This means there can not be any tall components between the CPU and heat sink side of the case, however, there is an allowance for low-profile components on the motherboard. The actual gap is approximately 12mm but we suggest that any component under the heat pipe be 10mm or less.

Yes, the ZF240 is different from our NanoPSUs which don’t occupy space outside of the motherboard. If you are planning to use the ZF240, please check the impact it will have on motherboard size here – ZF240 – Fanless PSU (under the usage tab)

There are a number of graphics cards on the market that are marketed as fanless and use integrated heat sinks to provide passing cooling for the GPU. The issue with these cards is that they are designed for use with ‘typical’ cases and depend on airflow from active cooling provided by the other fans installed in the case. As our cases tend to be very compact and do not provide any forced airflow, passive cards should not be used as they will likely overheat. If you do want to install a discreet GPU in a passively cooled case, it should be one that has specifically been designed for GPU cooling (such as the DB4), or modified to provide GPU cooling via the case heat sink.

The stock CPU mount supplied with the case is 56 x 56mm. Depending on the arm orientation, it can adapt to cooler mounting holes that are 80-90mm apart. The stock mount can not be used with CPUs that have cooler mounting holes less than 60mm apart.

There are really only 3 key points to check in order to determine if a motherboard is going to be compatible with the heat pipes (passive case cooling) …..

CPU socket location – this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this.
CPU socket type – this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount.
Component placement – probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink).

Additional heat pipes are available for some cases to allow for different locations and the HT4 can be used to raise the heat pipes above some components

LH4 – Compatible with the FC5, FC9, FC10
SH8, MH1 – Compatible with the FC8
HT4 – Compatible with the FC8*, FC9, FC10

If you are unsure, just get in touch, send us a link to the motherboard you are considering and we will confirm its compatible.

In the past, CPU TDP was a measure of the maximum required cooling performance of a cooler to maintain the normal operating temperature of the CPU. With the advent of performance “boosting” technologies, the specified TDP is no longer an accurate representation of the required cooling performance, but more a baseline reference. When these technologies are enabled, CPUs can boost well above the specified TDP rating and they try to take advantage of thermal overheads. It is therefore important when choosing a CPU for a fanless case to consider the actual maximum TDP that the CPU can output. Wherever possible, aim for a CPU TDP that is below the case TDP rating or consider BIOS settings that will limit the CPU to the maximum TDP supported by the case.

The current CPU mount supplied with the case features adjustable arms that are compatible with the majority of current desktop sockets

Intel® Socket

LGA775
LGA1366
LGA1155/6
LGA1150/1
LGA1200
LGA 2011-3*
LGA1700

AMD® Socket

AM2 & 2+
AM3 & 3+
FM1
FM2
AM1
AM4

Older units (pre-2019)

Intel® Socket

LGA775
LGA1366
LGA1155/6
LGA1150/1

AMD® Socket

AM1*1

AMD® Socket

AM2 & 2+
AM3 & 3+
FM1
FM2
AM4*2

The FAQ section has been designed to replace that will allow us to more frequently update customers with any information that is useful. If there is anything missing, just let us know and we will add it.

Yes, the top panel can support a monitor up to 20kg in weight, just be careful not to scratch the surface :p

In principle, it is possible to use the unused heat sink for cooling but we have not produced a GPU cooling kit for the case and it would require custom heat pipes. In addition, it would block the ability to use the ZF240 PSU.

The optical drive bracket has been designed specifically for use with 12.7mm thick drives, so whilst it might be possible to attach it in some way, officially it is not supported.

Assuming you don’t mind the visual compromise of the case being sideways (as the bottom will be visible) plus any marking of the worktop or case because it will rest on its side, then yes, it is possible to use them in a vertical orientation but there will be a slight reduction in cooling performance. As the fins are designed for convection, having them in horizontal orientation is not optimal but the heat pipes will work in any orientation and can actually benefit slightly from being vertical. I would recommend going with a 45W TDP CPU as this will allow more headroom for the reduction in performance but you should still be OK with a 65W, especially if you take some time to optimise it for fanless cooling by undervolting and ensuring it doesn’t boost too high and push the TDP over 65W.

Whilst we are considered in many ways a boutique manufacturer, its not possible for us to produce customised versions of our cases as one-offs or in limited numbers to cater for individual requirements and modifications. We are however able to offer a customisation service for businesses (OEM / ODM) and depending on the product and type of modification, this becomes viable at relatively low volumes.

If you can’t find the information you need, please send us a message using the ‘Get in Touch’ link at the top right of the page, choose the appropriate department and we will respond with the relevant information.