How do I know if a motherboard is compatible with the heat pipes?

There are really only 3 key points to check in order to determine if a motherboard is going to be compatible with the heat pipes (passive case cooling) ..... CPU socket location - this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this. CPU socket type - this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount. Component placement - probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink). Additional heat pipes are available for some cases to allow for different locations and the HT4 can be used to raise the heat pipes above some components LH4 - Compatible with the FC5, FC9, FC10 SH8, MH1 - Compatible with the FC8 HT4 - Compatible with the FC8*, FC9, FC10 If you are unsure, just get in touch, send us a link to the motherboard you are considering and we will confirm its compatible.

What CPU sockets are compatible with the case?

The current CPU mount supplied with the case features adjustable arms that are compatible with the majority of current desktop sockets Intel® Socket LGA775 LGA1366 LGA1155/6 LGA1150/1 LGA1200 LGA 2011-3* LGA1700 AMD® Socket AM2 & 2+ AM3 & 3+ FM1 FM2 AM1 AM4 Older units (pre-2019) Intel® Socket LGA775 LGA1366 LGA1155/6 LGA1150/1 AMD® Socket AM1*1 AMD® Socket AM2 & 2+ AM3 & 3+ FM1 FM2 AM4*2

FC8 – Fanless Mini-ITX Case

FC8

Compact Fanless ITX Case

With a volume of just 6ℓ but with a maximum TDP of 95W* the FC8 is a marvel of both thermal performance and minimalist design.

The small, sleek all aluminium construction features a highly efficient heat sink that minimises the industrial look by blending it with the outer curves of the case. Front connectivity is also not sacrificed with support for 2 x USB ports and an optional IR receiver, making this an ideal case for powerful and silent computing.

The FC8 Alpha is more than just the next iteration of the FC8 product line, its a massive redesign which subtly redefines its form and function.

The heatsink has been re-tooled to be sleeker, easier to clean, more balanced and ready for future heatpipe configurations. The top panel is now a single piece extrusion, making is virtually unbreakable, and the venting holes have been removed and replaced with a stealth side vent which reduces internal dust and improves convection airflow.

The drive tray has been totally re-design making it easier to install yet more versatile than ever, and now supports 2 x 3.5″* (up from just 1) whilst still having room for an optical drive and 2.5″ drive. If you prefer the non-optical version, there is room for an additional 2.5″ drive, taking the full capacity up to 5 x 2.5″ or 2 x 2.5″ + 2 x 3.5″ drives*. The tray also features variable drive position and orientation mounting, so you can optimally position your drives.

As with all Alpha cases, USB3.0 is native, the power LED is now a subtle pure white, the heatpipes and mounts have been uprated, and it is available with and without an optical drive opening.

The FC8 Evo is the next iteration of our acclaimed FC8 fanless chassis and with it comes a host of improvements and refinements that keeps this chassis on the cutting edge of design and performance.

The ultra-efficient heatsink has now been paired with our new direct touch heatpipes for even better cooling performance. The high grade aluminium extrusion is now finished with a fine sandblast texture and the front USB ports have been upgraded to support USB3.0*. Internal changes include easier drive assembly, support for an additional 2.5” drive and a universal optical drive eject button for added compatibility.

Just like its predecessor, the FC8 Evo is a perfect building block for any silent PC solution.

The original FC8 (now known as the V1) launched in 2011 and has been superseded by both the V2 and V3. The product page has been updated to show the current production version but the user guide and reviews of the V1 are still available below.

Overview

Specs

Dimensions

Gallery

Form Factor

ITX

Small Form Factor (SFF), mini tower, Mini-ITX & Mini-DTX motherboard support

CPU Cooling

87W*

*MAX TDP,
65W Recommended TDP

Expansion

Low Profile

Single Low Profile Slot,
Max 230 x 80 x 20mm

PSU

Nano

Requires Nano or Similar DC to DC style PSU, 5.5mm Rear Jack

Drives

3.5" & 2.5"

2 x 2.5″ + 2 x 3.5″ or 5 x 2.5″ or 3 x 2.5″ + 1 x 3.5″*1

Drives OPT

12.7mm

1 x ODD + ( 4 x 2.5″ or
1 x 2.5″ + 2 x 3.5″ or
2 x 2.5″ + 1 x 3.5″ )

Ports

2 x USB-A

19PIN USB 3.0 motherboard connector

IR Support

Optional

Front Panel IR Window,
Support for Flirc Module

Weight

2.5kg

2.5kg NET
5.3kg GROSS
(packed weight)

Dimensions

6ℓ

240 x 250 x 109mm
(W x D x H)
6ℓ volume

Material

AL6063

Aluminium 6063 for all outer panels & rails, steel brackets

Finish

Sandblast

Sandblast and anodized surface treatment, available in black or silver

Model

Black

SKU: ST-FC8B-ALPHA-OPT
EAN: 8718469090945

SKU: ST-FC8B-ALPHA
EAN: 8718469090969

Model

Silver

SKU: ST-FC8S-ALPHA-OPT
EAN: 8718469090990

SKU: ST-FC8S-ALPHA
EAN: 8718469090976

Features

EXTRUDED AND PRECISION MILLED PANELS

The FC8 is constructed using 4mm thick extruded profiles for the front, back and wrap-around top/side panel. The heat sink side extrusion is 37mm thick, with all panels being precision machining, hand polished, sandblasted and meticulous finished using a premium anodising process.

AN IDEAL COMPACT & SILENT DESKTOP

The FC8 is small, sleek and silent, all of which make it an ideal solution for a minimalist desktop system that blends perfectly into any enviroment.

MULTIPLE STORAGE DEVICE POSSIBILITIES

The FC8 was designed to be compact but without sacrificing on the type of storage devices that can be used, allowing for 3.5″, 2.5″ and 12.7mm optical storage devices all of which fit to the cleverly designed drive bracket.

INCREDIBLE COOLING PERFORMANCE

Despite being only 6ℓ in volume, the FC8 features an extremely compact yet efficient heat sink that is able to dissipate more than 87W of power from the CPU.

The FC8 also has the ability to utilise a number of different heat pipes and even the HT4, extending its compatibility to a wider range of motherboards and CPU locations.

Reviews & Media Coverage

View All

Expert Reviews

Build Blog

The QuietPC build has clearly been put together with care and the Streacom case is top quality

SFF Network

Written Review

The Streacom FC8 Alpha is a fine choice for a case, with the ability to passive cool a CPU an.....

OC Inside

Written Review

Das lüfterlose Streacom FC8 Alpha ITX Gehäuse überzeugt durch sein ausgezeichnetes Design, sehr gute Verarbeitung sowie ein ausgereiftes Kühlkonzept für.....

PC Ekspert

Written Review

FC8 Alpha će tako odlično poslužiti za maleno fancy računalo koje želite svima pokazivati ili pak kao HTPC gdje će.....

Zeden

Written Review

Avec son design sobre et réussi et sa finition exemplaire, il pourra débarquer dans votre salon sans problème. La conception.....

Profesional Review

Written Review

La Streacom FC8 Alpha cumple con todo lo que se le puede pedir a una caja HTPC de alta gama:.....

PCMhz

Written Review

Pentru premizele unui viitor excelent, pentru calitatea materialelor, pentru consumul redus şi silenţiozitatea maximă…… Streacom FC8 Alpha este alegerea mea.....

AMD Community

Build Blog

The first one is a “small size” home theater PC system, designed to fit beside typical entertainment equipment. It’s passively.....

OCAholic

Written Review

The FC08 from Streacom is one of the best HTPC cases money can buy these days, especially if you’re looking.....

Pure Overclock

Written Review

Streacom’s FC8 EVO Fanless Chassis comes with a sleek, elegant and uniquely designed layout. It’s small foot print and silence.....

Razorman

Written Review

Streacom juega la baza de un diseño realmente muy elegante y llamativo con esta caja Streacom Fc8 Evo que no.....

Tech Station

Written Review

Questo prodotto è assolutamente unico in termini di innovazione tecnica e i materiali sono ampiamente oltre lo standard dei migliori.....

The Lab

Written Review

Η ποιότητα πραγματικά είναι κορυφαία. Η εταιρία δεν τσιγκουνεύτηκε σε καμία περίπτωση τα υλικά, αλλά ούτε και τη τεχνογνωσία που.....

Nikk Tech

Written Review

Long story short the FC8 EVO is one of the best mITX cases we’ve ever seen due to its Fanless.....

Mad Shrimps

Written Review

The FC8 Evo case from Streacom has a very clean, professional look and is ideal for people which want absolute.....

59 Hardware

Written Review

Le Streacom FC8 Evo est à n’en point douter un boîtier luxueux : splendide, il dispose d’un niveau de finition.....

Twoje PC

Written Review

Wykonanie obudowy Streacom FC8 Evo jest na bardzo wysokim poziomie. Stonowany i elegancki wygląd w połączeniu z matowym aluminium sprawi,.....

PC SK

Written Review

Nestáva sa často (ak vôbec), aby si produkt, ktorému sme vytkli toľko nedostatkov, odniesol ocenenie. So Streacom FC8 Evo máme.....

Computer Base

Written Review

Die Verarbeitungsqualität bewegt sich auf höchstem Niveau und konnte uns restlos überzeugen. Ebenso erreicht das Streacom FC8 Evo eine hohe.....

Silent PC Review

Written Review

The Streacom FC8 Evo is a compelling product that stands out with its attractive and compact form factor. It is.....

Award Fabrik

Written Review

Mit dem FC8 bietet Streacom ein ungewöhnliches und exklusives Gehäuse an

Planet 3D Now

Written Review

Mit dem FC8 bietet Streacom ein Gehäuse an, das anscheinend die besten Eigenschaften bekannter Produkte vereint. Das Design ist schlicht.....

Extreme PC Hardware

Written Review

Der Übergang von den Praxiserfahrungen (lesen!) zum Fazit ist fließend. Die Begeisterung und der durchweg positive Eindruck ist kaum zu.....

Technic 3D

Written Review

Das Streacom FC8S gehört mit Sicherheit zu den schönsten und elegantesten HTPC-Gehäusen auf dem Markt. Es überzeugt durch ein sauberes,.....

Xtreme Hardware

Written Review

La qualità nella realizzazione di questo FC8 è dal nostro punto di vista il punto di forza di questo prodotto......

Jonny Guru

Written Review

My first mini ITX case turned out to be a very nice product indeed. Aside from a high price tag,.....

Support

FAQs

Downloads

As part of the cooler assembly, the heat pipes will pass over the motherboard to reach the side panel (heat sink). This means there can not be any tall components between the CPU and heat sink side of the case, however, there is an allowance for low-profile components on the motherboard. The actual gap is approximately 12mm but we suggest that any component under the heat pipe be 10mm or less.

There are a number of graphics cards on the market that are marketed as fanless and use integrated heat sinks to provide passing cooling for the GPU. The issue with these cards is that they are designed for use with ‘typical’ cases and depend on airflow from active cooling provided by the other fans installed in the case. As our cases tend to be very compact and do not provide any forced airflow, passive cards should not be used as they will likely overheat. If you do want to install a discreet GPU in a passively cooled case, it should be one that has specifically been designed for GPU cooling (such as the DB4), or modified to provide GPU cooling via the case heat sink.

The stock CPU mount supplied with the case is 56 x 56mm. Depending on the arm orientation, it can adapt to cooler mounting holes that are 80-90mm apart. The stock mount can not be used with CPUs that have cooler mounting holes less than 60mm apart.

There are really only 3 key points to check in order to determine if a motherboard is going to be compatible with the heat pipes (passive case cooling) …..

CPU socket location – this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this.
CPU socket type – this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount.
Component placement – probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink).

Additional heat pipes are available for some cases to allow for different locations and the HT4 can be used to raise the heat pipes above some components

LH4 – Compatible with the FC5, FC9, FC10
SH8, MH1 – Compatible with the FC8
HT4 – Compatible with the FC8*, FC9, FC10

If you are unsure, just get in touch, send us a link to the motherboard you are considering and we will confirm its compatible.

In the past, CPU TDP was a measure of the maximum required cooling performance of a cooler to maintain the normal operating temperature of the CPU. With the advent of performance “boosting” technologies, the specified TDP is no longer an accurate representation of the required cooling performance, but more a baseline reference. When these technologies are enabled, CPUs can boost well above the specified TDP rating and they try to take advantage of thermal overheads. It is therefore important when choosing a CPU for a fanless case to consider the actual maximum TDP that the CPU can output. Wherever possible, aim for a CPU TDP that is below the case TDP rating or consider BIOS settings that will limit the CPU to the maximum TDP supported by the case.

The current CPU mount supplied with the case features adjustable arms that are compatible with the majority of current desktop sockets

Intel® Socket

LGA775
LGA1366
LGA1155/6
LGA1150/1
LGA1200
LGA 2011-3*
LGA1700

AMD® Socket

AM2 & 2+
AM3 & 3+
FM1
FM2
AM1
AM4

Older units (pre-2019)

Intel® Socket

LGA775
LGA1366
LGA1155/6
LGA1150/1

AMD® Socket

AM1*1

AMD® Socket

AM2 & 2+
AM3 & 3+
FM1
FM2
AM4*2

The FAQ section has been designed to replace that will allow us to more frequently update customers with any information that is useful. If there is anything missing, just let us know and we will add it.

If you have the V3 (Alpha) version of the case, you can use the HT4 in combination with the SH2 heat pipes but it will limit the space available for 3.5″ drives. Depending on CPU location, it might still be possible to install a 3.5″ drive, but it’s not recommended.

There are 3 different designs of heat pipe for the FC8 in order to support different motherboard CPU locations and because of the different version of the case, i.e. V2(Evo) and V3(Alpha). It should be noted that the original FC8 V1 is not compatible with the current heat pipes. Currently, the V3 is supplied with the SH2 heat pipes. These heat pipes are NOT compatible with the V2. If you require the equivalent heat pipes to support that CPU location on a V2, you will need the MH1 heat pipes. SH8 heat pipes are compatible with both V3 and V2 cases but are designed for the typical thin-ITX CPU location.

The optical drive bracket has been designed specifically for use with 12.7mm thick drives, so whilst it might be possible to attach it in some way, officially it is not supported.

Assuming you don’t mind the visual compromise of the case being sideways (as the bottom will be visible) plus any marking of the worktop or case because it will rest on its side, then yes, it is possible to use them in a vertical orientation but there will be a slight reduction in cooling performance. As the fins are designed for convection, having them in horizontal orientation is not optimal but the heat pipes will work in any orientation and can actually benefit slightly from being vertical. I would recommend going with a 45W TDP CPU as this will allow more headroom for the reduction in performance but you should still be OK with a 65W, especially if you take some time to optimise it for fanless cooling by undervolting and ensuring it doesn’t boost too high and push the TDP over 65W.

Whilst we are considered in many ways a boutique manufacturer, its not possible for us to produce customised versions of our cases as one-offs or in limited numbers to cater for individual requirements and modifications. We are however able to offer a customisation service for businesses (OEM / ODM) and depending on the product and type of modification, this becomes viable at relatively low volumes.

If you can’t find the information you need, please send us a message using the ‘Get in Touch’ link at the top right of the page, choose the appropriate department and we will respond with the relevant information.