With a volume of just 6ℓ but with a maximum TDP of 95W* the FC8 is a marvel of both thermal performance and minimalist design.
The small, sleek all aluminium construction features a highly efficient heat sink that minimises the industrial look by blending it with the outer curves of the case. Front connectivity is also not sacrificed with support for 2 x USB ports and an optional IR receiver, making this an ideal case for powerful and silent computing.
The FC8 Alpha is more than just the next iteration of the FC8 product line, its a massive redesign which subtly redefines its form and function.
The heatsink has been re-tooled to be sleeker, easier to clean, more balanced and ready for future heatpipe configurations. The top panel is now a single piece extrusion, making is virtually unbreakable, and the venting holes have been removed and replaced with a stealth side vent which reduces internal dust and improves convection airflow.
The drive tray has been totally re-design making it easier to install yet more versatile than ever, and now supports 2 x 3.5″* (up from just 1) whilst still having room for an optical drive and 2.5″ drive. If you prefer the non-optical version, there is room for an additional 2.5″ drive, taking the full capacity up to 5 x 2.5″ or 2 x 2.5″ + 2 x 3.5″ drives*. The tray also features variable drive position and orientation mounting, so you can optimally position your drives.
As with all Alpha cases, USB3.0 is native, the power LED is now a subtle pure white, the heatpipes and mounts have been uprated, and it is available with and without an optical drive opening.
The FC8 Evo is the next iteration of our acclaimed FC8 fanless chassis and with it comes a host of improvements and refinements that keeps this chassis on the cutting edge of design and performance.
The ultra-efficient heatsink has now been paired with our new direct touch heatpipes for even better cooling performance. The high grade aluminium extrusion is now finished with a fine sandblast texture and the front USB ports have been upgraded to support USB3.0*. Internal changes include easier drive assembly, support for an additional 2.5” drive and a universal optical drive eject button for added compatibility.
Just like its predecessor, the FC8 Evo is a perfect building block for any silent PC solution.
The original FC8 (now known as the V1) launched in 2011 and has been superseded by both the V2 and V3. The product page has been updated to show the current production version but the user guide and reviews of the V1 are still available below.
EXTRUDED AND PRECISION MILLED PANELS
The FC8 is constructed using 4mm thick extruded profiles for the front, back and wrap-around top/side panel. The heat sink side extrusion is 37mm thick, with all panels being precision machining, hand polished, sandblasted and meticulous finished using a premium anodising process.
INCREDIBLE COOLING PERFORMANCE
Despite being only 6ℓ in volume, the FC8 features an extremely compact yet efficient heat sink that is able to dissipate more than 87W of power from the CPU.
The FC8 also has the ability to utilise a number of different heat pipes and even the HT4, extending its compatibility to a wider range of motherboards and CPU locations.
Reviews & Media Coverage
- CPU socket location – this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this.
- CPU socket type – this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount.
- Component placement – probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink).