The FC9 follows the same design vision as the FC10, featuring a minimalist curved exterior and exceptional hardware compatibility but in a more compact, mid-sized form factor that has a 30% smaller footprint.
The all-aluminium sandblasted finish houses a multitude of features such as Heatpipe Direct Touch cooling, universal optical drive eject button and a pivoting drive cage that makes assembly easier than ever. More than just a computer enclosure, the FC9 is a work of art that beautifully combines form and function.
The FC9 V2 (aka Alpha) takes all the great features of the original FC9 and improves upon then with small yet important changes. The drive tray has been re-design with variable drive positions, better airflow and now utilizes the new optical drive tray for easier installation and adjustment. The bottom panel has been updated with improved venting and more drive mounting locations, and USB ports have now been placed on both of the side panels for easier access and balance.
For a full breakdown of all the changes, please see the press release.
The original FC9 was launched in 2012 and was replaced by the V2 AKA the Alpha version
PERFECTLY SUITED FOR THE LIVING ROOM ENVIRONMENT
Designed with the living room environment in mind, the fanless (no noise) cooling subtle styling and illumination, optional optical drive and IR support, all wrapped in a beautiful premium aluminium sandblasted finish, the FC9 is the ideal platform for a high-end HTPC system
INTERNAL AND EXTERNAL PSU SUPPORT
The FC9 is a compact case with a volume of just 11ℓ but can still accommodate the internal ZF240 when combined with a mini-ITX motherboard.
When using an external Nano type PSU, the FC9 has support for a micro-ATX motherboard ad features a dedicated drive tray for 3.5″, 2.5″ drives, and an optical version for slot loading drives.
IMPROVED HARDWARE COMPATIBILITY
Whist our previous cases all feature an adjustable heat pipe mounting solution to accommodate for different motherboard CPU locations, the FC9 is also capable of overcoming tall components such as VRM cooling heat sinks when combined with the optional HT4. This option to raise the heat pipes above obstacles on the motherboard gives the FC9 a unique height adjustment allowing for greater motherboard compatibility.
- CPU socket location – this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this.
- CPU socket type – this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount.
- Component placement – probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink).