The FC9 follows the same design vision as the FC10, featuring a minimalist curved exterior and exceptional hardware compatibility but in a more compact, mid-sized form factor that has a 30% smaller footprint.
The all-aluminium sandblasted finish houses a multitude of features such as Heatpipe Direct Touch cooling, universal optical drive eject button and a pivoting drive cage that makes assembly easier than ever. More than just a computer enclosure, the FC9 is a work of art that beautifully combines form and function.
The FC9 V2 (aka Alpha) takes all the great features of the original FC9 and improves upon then with small yet important changes. The drive tray has been re-design with variable drive positions, better airflow and now utilizes the new optical drive tray for easier installation and adjustment. The bottom panel has been updated with improved venting and more drive mounting locations, and USB ports have now been placed on both of the side panels for easier access and balance.
For a full breakdown of all the changes, please see the press release.
The original FC9 was launched in 2012 and was replaced by the V2 AKA the Alpha version
PERFECTLY SUITED FOR THE LIVING ROOM ENVIRONMENT
Designed with the living room environment in mind, the fanless (no noise) cooling subtle styling and illumination, optional optical drive and IR support, all wrapped in a beautiful premium aluminium sandblasted finish, the FC9 is the ideal platform for a high-end HTPC system
INTERNAL AND EXTERNAL PSU SUPPORT
The FC9 is a compact case with a volume of just 11ℓ but can still accommodate the internal ZF240 when combined with a mini-ITX motherboard.
When using an external Nano type PSU, the FC9 has support for a micro-ATX motherboard ad features a dedicated drive tray for 3.5″, 2.5″ drives, and an optical version for slot loading drives.
IMPROVED HARDWARE COMPATIBILITY
Whist our previous cases all feature an adjustable heat pipe mounting solution to accommodate for different motherboard CPU locations, the FC9 is also capable of overcoming tall components such as VRM cooling heat sinks when combined with the optional HT4. This option to raise the heat pipes above obstacles on the motherboard gives the FC9 a unique height adjustment allowing for greater motherboard compatibility.
There are really only 3 key points to check in order to determine if a motherboard is going to be compatible with the heat pipes (passive case cooling) …..
- CPU socket location – this is less of an issue these days as most motherboards have similar socket locations (other than thin-ITX) and as the heat pipes do have some adjustment, most motherboard will comply with this.
- CPU socket type – this should be one of the standard desktop sockets, not an embedded or server one type that will either be too small or too large for the CPU cooler mount.
- Component placement – probably the most common reason for a motherboard to not be compatible is the placement of components that might block the path of the heat pipes. Typically this will be VRM cooling heat sinks or plugs, but its easy to evaluate as there should be a clear path for the heat pipes to pass from the CPU socket to the side of the case (heat sink).
In the past, CPU TDP was a measure of the maximum required cooling performance of a cooler to maintain the normal operating temperature of the CPU. With the advent of performance “boosting” technologies, the specified TDP is no longer an accurate representation of the required cooling performance, but more a baseline reference. When these technologies are enabled, CPUs can boost well above the specified TDP rating and they try to take advantage of thermal overheads. It is therefore important when choosing a CPU for a fanless case to consider the actual maximum TDP that the CPU can output. Wherever possible, aim for a CPU TDP that is below the case TDP rating or consider BIOS settings that will limit the CPU to the maximum TDP supported by the case.
The current CPU mount supplied with the case features adjustable arms that are compatible with the majority of current desktop sockets
The FAQ section has been designed to replace that will allow us to more frequently update customers with any information that is useful. If there is anything missing, just let us know and we will add it.
In principle, it is possible to use the unused heat sink for cooling but we have not produced a GPU cooling kit for the case and it would require custom heat pipes. In addition, it would block the ability to use the ZF240 PSU.
The optical drive bracket has been designed specifically for use with 12.7mm thick drives, so whilst it might be possible to attach it in some way, officially it is not supported.
Assuming you don’t mind the visual compromise of the case being sideways (as the bottom will be visible) plus any marking of the worktop or case because it will rest on its side, then yes, it is possible to use them in a vertical orientation but there will be a slight reduction in cooling performance. As the fins are designed for convection, having them in horizontal orientation is not optimal but the heat pipes will work in any orientation and can actually benefit slightly from being vertical. I would recommend going with a 45W TDP CPU as this will allow more headroom for the reduction in performance but you should still be OK with a 65W, especially if you take some time to optimise it for fanless cooling by undervolting and ensuring it doesn’t boost too high and push the TDP over 65W.
If you can’t find the information you need, please send us a message using the ‘Get in Touch’ link at the top right of the page, choose the appropriate department and we will respond with the relevant information.