product announcement

The high-end CPU and GPU performance arms race has been pushing power and TDP limits higher but fortunately, progress is also being made for more power-efficient CPUs with much lower TDPs that still offer competitive performance thanks to improvements in their integrated graphics.

Whilst there is no shortage of fanless cases on the market that can cool these lower TDP CPUs, they have been geared towards industrial applications, tend to be expensive, and offer very little in the way of design.

The DB1 is here to change that with a case that delivers all the benefits of fanless/silent computing, but in an ultra-compact form factor that once again breaks the mould of typical fanless cases.

With a total volume less than 5l (222 x 222 x 101 mm), the DB1 is our most compact fanless case but can still comfortably handle 45W of cooling, which is ideal for power-efficient systems based on the new generation of APU/IGPUs that deliver excellent performance/watt.

The DB1 is constructed from 4mm thick aluminium panels, a 21mm thick extruded heat sink, solid aluminium pillars and is made using CNC milling and finished with sandblasted/anodised surface treatment, but despite using these premium materials, processing and finish, is extremely competitively priced.

The beauty of the DB1 (apart from its appearance) is the simplicity of its design that used 4 solid aluminium pillars to connect the heat sink and side panel that in turn secure the front, rear, upper and lower panels in place. This approach greatly reduces complexity, combines functionality (as the pillars also serve as the feet), and mean that the entire case can be fully disassembled with just 8 screws.

This design also allows for great flexibility in orientation and placement of the case, every panel can be rotated to allow for left or right positioning and inverted orientations. The modularity also means that requirements for customization are lower, making this an excellent platform for system integrators.

With our approach to fanless, the cooling is done by the case itself and the DB1 is no exception. Using the same copper CPU shim, adjustable CPU mount and heat sink mount as our DB4, heat is transferred from the CPU to the heat sink (side panel) using 6mm copper heat pipes and dissipated into the environment along its surface and fins which are optimised for natural convection.

With the combination of the universal CPU mount and fully position adjustable heat sink mount, there are virtually no motherboard compatibility issues as the socket location is not a limiting factor and conflicts with board components are minimised.

The stock CPU mount is compatible with all current desktop sockets and there is also an optional compact CPU mount to expand that compatibility to less common sockets such as FCBGA 1667 or even more specialist soldered CPUs.

It’s hard to appreciate just how small and tightly packed some our compact cases are, to the extent that we sometimes get asked if it’s possible to install an SFX or even ATX PSU inside them.

For some context, the DB1 is not much larger than the ITX motherboard it holds, and this ultra small form factor is only made possible by the use of a NanoPSU that plugs directly into the motherboard.

Apart from reducing the space required, use of the Nano PSU has two other advantages,
1. It reduces the amount of heat being dumped inside the case as the AC to DC conversion is happening in the external AC adapter, and …
2. It is fanless, no need to expand on how important that is for a fanless system

With the target TDP, power draw and price point that the DB1 was designed for, it was important to have a suitable matching power solution, so we are introducing a new NanoPSU that can match these criteria. The Nano90 is our most compact and affordable NanoPSU yet, delivering 90W of power with zero noise and will be available at the launch of the DB1.

Modularity and versatility are principles we always try to incorporate into our designs, so with the DB1 we have made all the panels interchangeable and added an option to rotate the internals by 90 degrees, allowing any variation of heat sink and front panel position/orientation.

The DB1 was of course design to work primarily in the vertical orientation as that occupies the least amount of desk space and also gives the best cooling performance as convection is optimised. It can however also be used in the horizontal orientation with the ability to position the front I/O at either side of the case.

The front I/O is also modular and uses the same module as the DA2 so included Type-A 19PIN can be replaced with an optional Type-C 19PIN or 3.1 Gen2 or any future standard.

This modularity and cross-platform approach is part of our wider commitment to product continuity and ensuring the case you buy today does not become obsolete when new hardware is released.

The DB1 will be available with resellers in Q1 2021 to retail for ~ 109EUR / 129USD.
The Nano90 will be available at the same time with a retail price of ~ 68EUR / 79USD.

Full details and specs can be found in the product introduction PDF and on the DB1 product page
It’s been just over 2 years since we released the DA2 during which time it has received many great reviews and featured in plenty of amazing builds, but nothing is perfect and we have been listening to what could be improved, so the time has come for us to address by far the biggest criticism ….. holes!

We are pleased to announce the DA2 Version 2, same amazing design but with revised ventilation patterns on the back and side panels. Both the pitch and size have been adjusted, effectively double the number of holes, greatly reducing impedance to airflow.

The performance acrylic panels are now fitted as standard, further improving airflow and providing additional fan mounting options.

Apart from the revised ventilation pattern, the back panel now features a new single larger opening for the PCIe card and an angled PSU passthrough cable that avoids conflicts with bigger CPU coolers and motherboard daughter boards.

With the release of the RTX 3000 series cards and its radical cooler design, the DA2 has a clear advantage compared with sandwich-style case layouts that are not optimal for this airflow configuration. The DA2 provides unrestricted access to fresh air from below the case, the optional rear case fan removes warm air being blown upwards from the rear GPU fan and even the SFX PSU can be rotated 90 degrees to assist with that.

There are other small tweaks to the construction and included parts that improve the overall build and versatility of the DA2, but in short, the V2 is the same great case but with improved thermal performance.

The DA2 Version 2 will be available at selected retailers starting the second week of October and with all retailers by the end of November depending on the region.
We are pleased to announce a host of new accessories for the DA2 that expand upon the functionality of this already versatile case.

We designed the DA2 from the ground up to be a modular and adaptable platform, one that could be added to and enhanced over time without requiring a new revision of the case to be released and providing an upgrade path to existing owners.

In total we are making six accessories official…..

1. Vertical & Horizontal Brackets
2. USB 3.1 Gen2 Type-C Cable
Both of which have been available from us directly from us for some time but are now officially listed.

3. Front I/O Module Type-A USB
4. Performance Acrylic Panel Kit
5. Tempered Glass Side Panel Kit
These are available from today and will be with retailers shortly.

6. Vertical GPU Kit
Planned to be available by Q2 2020.

For more information please visit the individual product pages or contact us directly.
We are pleased to announce the DA2 ……. in short
Its a compact ITX case designed to strike a balance between size and compatibility, allowing high performance components to fit comfortably in a small form factor space.

The Concept
Whilst there are compact cases on the market that do a great job of cramming high performance components into a super tiny space, they tend to focus on being “the smallest” and in doing so suffer from limited cooling, poor versatility and a generic uninspirational designs. With the DA2 we created a case that focuses on cooling performance and compatibility, whilst still being true to the size principles of small form factor and incorporating our minimalist design and premium construction ethos.

Same Same
There are lots of examples of what makes this case different, but beyond just the specification or features there is a fundamental difference in the approach that drives everything we produce. Being one of the few small independent manufacturers on the market, we do not depend on OEM facilities and shared tooling, nor do we suffer from the bureaucracy of larger organizations. This means we are not trapped in any specific design path and have the freedom to explore a different approach, which is why our products are genuinely different.

Hello Airflow
How about this for an idea, a case that considers cooling might actually be more important than RGB lighting. There are of course situations when lighting can work really well to enhance a products aesthetic, but its an unfortunate state when they come at the expense of performance and basic functionality. The DA2 upper and lower openings in the frame are a design aesthetic but they are also there to improve cooling and avoid the issue most cases suffer from, lower intake airflow restriction. That combined with the over 2000 precision holes on the back and side panels, plus the ability to support multiple fans in virtually any location, results in excellent airflow and cooling performance.

The Universal Approach
Dedicated bays for drives, fans, radiators, etc are great for making builds fast and easy, but terrible if you want to optimize the usable space and create a truly customizable platform. So when we created our last 2 cases, the F12C and DB4, we pioneered the use of something we called the universal bracket. The DA2 also utilizes this innovative approach with a track that is integrated into the frame, allowing the brackets be fitted anywhere along the sides of the case. The unique approach to hardware mounting means even the PSU can be relocated making this case extremely versatile and customizable.

Compact but Compatible
Being able to fit a wide range of components and build a compact but powerful system was a key focus thought the design process, so the DA2 can comfortably fit a 240mm radiator and a full size GPU, but beyond that its also extremely flexible. With a shorter GPU (upto 225mm) an ATX PSU can be used whilst still having enough room for a 140mm AIO. If you dont want to go the water cooling route and prefer a performance air cooler, the DA2 is not limited to a low profile style cooler and has space for a tower design up to 145mm.

Balance of Design and Function
Design and aesthetic is absolutely objective, but we have considered every line, every curve, every screw placement to not only be functional but also visually appealing. The devil is in the details, and whilst on paper one case might look very similar to another, its those small things that add up to make a vastly different product experience when its physically sitting there on your desk.

For more on the DA2 we have a PDF ( DA2 - Product Introduction ) which goes into more detail about what makes this case special. The DA2 will be officially launched at Computex 2018 (5th June) where it will be shown in public for the first time and is expected to be available in retail stores by mid August. Product page will also go live on that date, link will go here :) …… DA2 Product Page
Streacom is pleased to announce the F12C Optical, an addition to the F12C product line that adds Optical drive and front USB 3.0 support to the case. As with the original F12C, its built using the same high quality 4mm thick extruded materials, CNC processing and meticulous sandblasted anodising finish. These premium processes along with our innovative and flexible approach to hardware mounting sets this case apart from the competition, and make it the ideal choice for high end living room systems.

For full details,specification and pictures, check our F12C product page

Introducing the DB4, our most ambitious fanless case to date, featuring a bisymmetrical design that is uniquely bold and blurs the lines between technology and art.

With the DB4 we set out to not only redefine what a PC case could look like, but the performance and compatibility achievable from a fanless solution. Every element of this case subtly screams premium, from the 13mm thick extruded aluminium side panels to the precision CNC’d internal frame, all perfectly blended together with our characteristically understated design tone.

The identical sides of the case serve both as the striking monolithic exterior and the convection surface (or heat sink) for component cooling and is the basis of its fanless operation. The challenge was to create an efficient heat sink that didn’t look industrial, one that would actually be integral to the sleek exterior, and the result speaks for itself. Each side can handle 65W of heat dissipation and can be coupled to provide 120W of total CPU cooling.

Beyond simply looking impressive, the DB4 solves one of the biggest complexities of building a fanless case. Traditionally motherboard choice is limited and alternative heat pipes might be required depending on layout, but the DB4 rewrites the rules. With both the motherboard and side panels being parallel, the heat pipes run perpendicular, away from any components and in combination with the flexibility of the universal bracket, means that virtually all ITX motherboard are compatible with the case.

Our existing CPU mount has also been re-engineered to be adjustable and universally compatible with any socket. It now features a copper shim interface between the IHS and heat pipes which creates a more efficient all copper thermal path to the heat sink, greatly improving cooling performance. To make assembly easier, all the side panels are removable, as is the motherboard tray, leaving an open frame with plenty of accessibility.

Building on the innovation of our F12C, components are fitted using a universal bracket system that supports, drives, heat sink mounts and the ZF240, allowing components to be mounted anywhere along the frame of the case, delivering a truly modular and flexible layout.

The DB4 measures 260 x 260 x 270mm but still manages to accommodate an ITX motherboard, a dual slot full height PCI card (max 200mm), up to 5 x 3.5” or 12 x 2.5” drives (lots of combinations in between), and can be powered by our Nano or ZeroFlex PSU solutions.

Full specifications are on the DB4 product page.

The Nano120 is the latest addition to our fanless, silent, small form factor range of power solutions and this time we have focused on energy efficiency. With a constant trend towards lower power consumption and reduced energy waste, it was important for us to release a product that addressed these consumer and industrial needs.

With an efficiency of 87% + and standby power consumption of under 0.5W, the Nano120 not only fully complies with all EU regulations but sets an industry leading benchmark for this form factor.

The increase in efficiency also means a reduction in heat and that combined with the use of Japanese components mean higher reliability, stability and compatibility.

For full details and specification, check our Nano120 product page
Streacom is pleased to announce the F12C, our first case designed to accept all FULL SIZE STANDARD ATX components for a zero compromise system. Of course being Streacom, its built using the same high quality 4mm thick extruded and CNC’d materials and processes that sets our cases apart from the competition and we developed an innovative mounting solution that offers more flexibility that ever before.

For full details,specification and pictures, check our F12C product page
Streacom ALPHA is the culmination of a yearlong project to re-design, re-engineer, and refine all aspects of our computer chassis range, from production right through to the packaging. We scrutinized every single part, the smallest screw to the largest aluminium extrusion and asked a simple question …….. “If you could start from scratch, what would you change ?”

Make no mistake, whilst on the surface ALPHA cases may look almost identical, not a single part from any previous case has been re-utilized. More than just a product revision, it is a total reboot and lays the foundation for future product compatibility, expansion, and manufacturing processes.

With the unified internal design, all Alpha cases will be available with and without optical drives, so we are also introducing a naming change. Cases with optical drive openings will have the ‘Optical’ suffix, those without will simply carry the model name.

Whist every ALPHA case has its own unique set of changes compared with its predecessor, they all share the following upgraded features:

  • Higher precision extrusion, CNC and tolerances for all aluminium parts
  • New anodizing process with improved surface treatment which is more dust/mark resistant
  • Redesigned drive trays for easier installation, greater flexibility and more storage options
  • The introduction of a dedicated optical drive tray for easier fitting and adjustment
  • Optimized venting to improve internal convection airflow and cooling
  • Refined power button with O-ring damper and pure white power LED indicator
  • Front/side USB ports are 3.0 as standard and PCB-free for higher speed and compatibility
  • Uprated heatpipes and improved mount surfaces for better thermal performance
  • Fewer visible screws and aesthetic refinements to all sides and surfaces
  • Unified internal designs allowing for non-optical versions across the range
  • Reduced IR window acrylic thickness to improve detection and increase remote range
  • New packaging with less waste, better protection and easier product removal
  • Improved documentation with revised procedures and clearer part identification
  • Updated CPU mount to support AMD socket AM1
Individual case improvements include:
  • FC5 – Redesigned bottom panel with higher strength, improved convection and more drive options
  • F7C – Added supports for 92mm fan and larger side venting for more airflow
  • FC8 – Top panel holes replaced with stealth side panel vent, cleaner looks and reduced internal dust
  • FC8 – Redesigned heatsink, sleeker, more balanced, less industrial looking and much easier to clean
  • F7C & FC8 – Single piece extruded top panel, virtually unbreakable design, better fit
  • F7C & FC8 – Simplified drive tray with easier installation, more drives and more component clearance
  • F7C & FC8 – Dedicated SSD mounting brackets for easier installation
  • FC5, FC9, FC10 – USB ports are now on both sides for better accessibility and balance
  • FC5, FC9, FC10 – Thicker top panel brackets reduces the chance of thread damage
  • FC5, FC9, FC10 – New silicon feet pads for better dampening, grip and surface protection
  • FC9 & FC10 – New drive tray with variable position drive mounting
  • FC10 – Standard width PCI expansion slots for dual card support

Below are some Alpha photo highlights and product pages are now live, so click the links below to detailed spec and pictures for each product: FC5 Alpha, F7C Alpha, FC8 Alpha, FC9 Alpha, FC10 Alpha

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