Product Introduction

Preface to our Online Guides

We appreciate that for some, a printed user guide will always be the preferred option, which is why, in the past, we had always produced a clear and comprehensive one.

With the aim of reducing our environmental impact and waste, we have switched to this online guide. Beyond simply reducing material waste, this online format allows for an even more comprehensive product guide with more detailed steps and the ability to add or improve any part of the guide quickly based on user feedback.

Thank you for your understanding and if we can do anything to improve this experience, please let us know.

Introduction to the SG10

The SG10, a collaboration between Streacom and Calyos, is a fanless PC case based on Loop Heat Pipe (LHP) technology, that delivers gaming/workstation-grade cooling for CPUs and GPUs without fans, offering over 600W of total heat dissipation. This new approach, utilising an evaporator (patented solid-state phase change pump) and convection-optimised condenser, represents a significant advancement in PC cooling and for the first time, provides a viable high-performance fanless alternative to traditional cooling solutions. The SG10 not only delivers impressive fanless cooling capabilities but also incorporates a bold, industrial design and unique features such as the adjustable diagonal motherboard and GPU mounting systems and modular movable IO panels, making it a standout product in the PC case market, even without the groundbreaking fanless performance.

The Copper Edition is a special limited production run featuring an all-copper condenser. Only 500 of these will be made in total. The ‘standard’ SG10 features an Aluminium Fin but throughout this online guide, images of both versions will be used as they share the same assembly and features.

Construction Overview

Glass Side Panel

Front I/O Module

Rear Assembly

Front Assembly

Upper Rails

CPU Cooler Loop

PSU Mount

GPU Cooler Loop

Diagonal Brackets

Horizontal Brackets

 

Lower Rails

This is an exploded view to make it easier to highlight the key components of that make up the case

Key Structural Components

The SG10 can be broken down into 3 key sections …

  1. The Front/Back Assembly – Consisting of the Upper and Lower Aluminium profiles, joined together by metal strips to form the slatted front/back design
  2. The LHP (Loop Heat Pipe) Solution – Dominated by the two identical large condenser that is used to radiate heat away from the CPU/GPU, via the evaporators that mount to them.
  3. The Center X-Frame Structure – Comprising of the mounting rails, the diagonal brackets and the universal brackets, where all the hardware will be fitted.

Like all Streacom fanless cases, the SG10 cooling solution is highly integrated into the case both structurally and visually. This approach is critical in order to achieve the best results from a passive cooling solution as component placement (specifically the condenser/radiator) plays a significant role in performance.

The SG10 is large and heavy but the base has been designed with a large opening and the front and back that provide an ideal position to life the case from. Whilst the upper opening can also be used, we suggest to use the lower opens when lifting and moving the case.

Optimised for Fanless Cooling

The SG10 has the highest fanless cooling capabilities of any consumer PC case ever made, featuring 600W of combined cooling across its two independent cooling loops.

Both loops are identical in every way, comprising of an Evaporator (that mounts to the CPU or GPU), the Condenser that provides a massive surface area to dissipate the heat (primarily with convection) and flexible steel lines that connect them.

Evaporator

Flexible Steel Lines

Condenser

To achieve these levels of performance, the entire case was designed around the requirements of the condenser. Its surface, ideal orientation and fin spacing have been used to define the design of the case. Whilst the ‘chimney’ effect is something that is often attributed to fanless cooling, a vertical fin stack would be less optimal both in terms of getting cooler ambient air and optimising for the vapour pressure.

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